Automotive Peripheral Bridge ICs

SoCs, widely applied in smartphones and tablets, are increasinly appearing in automotive applications as IVI systems become more sophisticated, requiring greater functionality and higher performance. But because connectivity standards differ among devices such as displays, existing SoCs often lack the interfaces required for automotive networks.

Lineup

Connectivity Product Line-up
  Camera HDMI® Display Display
Automotive
TC9591XBG TC9590XBG TC9592XBG
TC9593XBG TC9594XBG TC9595XBG
Consumer
TC358748I TC358743I TC358774 TC358775 TC358778 TC358867
Input

MIPI CSI2 RX 4Lanes x 1ch

Parallel input 24bit@154MHz

HDMI® 1.4a MIPI DSI
4 Lanes x 1ch
MIPI DSI
4 Lanes x 1ch
Parallel input 
24bit@154MHz
MIPI DSI
4 Lanes x 1ch.
/ MIPI DPI (24bit)
Output

Parallel output 24bit@100MHz

MIPI CSI2-TX
4Lanes x 1ch

MIPI CSI2-TX
4Data LanesX1ch
LVDS
Single Link 
(5 pairs/ link)
LVDS
Dual Link
(5 pairs/ link)
MIPI DSI-TX
4Lanes x  1ch
Display Port 1.1a
x 2 Ports
MIPI DPI (24bit)
Resolution - - UXGA
1600x1200
@24bit
WUXGA
1920x1200
@24bit
WUXGA
1920x1200
@24bit
WUXGA
1920x1200
@24bit
Ta -40 ~ 105℃ -40 ~85℃ -40 ~ 85℃
-40 ~ 85℃ -40 ~ 105℃ -40 ~ 85℃
PKG VFBGA80
7mm x 7mm
0.65mm pitch
LFBGA64
7mm x 7mm
0.8mm pitch
VFBGA49
5mm x 5mm
0.65mm pitch
VFBGA64
6mm x 6mm
0.65mm pitch
VFBGA80
7mm x 7mm
0.65mm pitch
VFBGA80
7mm x 7mm
0.65mm pitch
Automotive Peripheral Bridge IC TC9594XBG
Automotive Peripheral Bridge IC for In-Vehicle Infotainment (IVI) systems – Parallel to MIPI DSI℠
Automotive Peripheral Bridge IC TC9594XBG
Automotive Peripheral Bridge IC TC9595XBG
Automotive Peripheral Bridge IC for In-Vehicle Infotainment (IVI) systems - MIPI DSI / DPI℠ to DisplayPort™
Automotive Peripheral Bridge IC  TC9595XBG

Technical topics

System Block Diagram

System Block Diagram

Necessity of AMPD (Interface Bridge IC)

SoC with only MIPI I/Fs as AV I/F may require AMPDs to connect external devices such as displays and cameras.

Necessity of AMPD (Interface Bridge IC)

Toshiba’s new range of video interface bridge devices provide HDMI® to MIPI® CSI-2 (TC9590), MIPI® CSI-2 to/from parallel (TC9591), and MIPI® DSI to LVDS (TC9592/3) connectivity. The devices are offered in 0.65mm pitch, VFBGA packages between 5 x 5 mm and 7 x 7mm, with the exception of the TC9590 which is housed in an LFBGA64, 0.8mm pitch 7 x 7mm package.

Toshiba has a long track record of developing MIPI® -based interface bridge chips for consumer applications and has drawn on this experience in developing the new automotive IVI range.

Sample shipments of the new devices start in June 2018.

Applications

IVI (In-vehicle Infotainment)
Such as information sharing and reduction of power consumption are important in designing IVI. Toshiba provides information on a wide range of semiconductor products suitable for display and audio output section, video and voice input section, wireless communications section, etc., along with circuit configuration examples.
Advanced Driver-Assistance Systems (ADAS)
Such as reduction of power supply and signal noise and reduction of power consumption are important in designing ADAS. Toshiba provides information on a wide range of semiconductor products suitable for image input units, power supply units, data transmission and audio output units, etc., along with circuit configuration examples.

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